Picosun Drives Innovation in Chip Packaging

Picosun Drives Innovation in Chip Packaging

ESPOO, Finland, August 30, 2016 /PRNewswire/ --

    Picosun Oy, the leading supplier of advanced Atomic Layer Deposition (ALD)
manufacturing solutions, partners with A*STAR's Institute of Microelectronics (IME) in
Singapore and global, prominent semiconductor industries to develop next generation chip
packaging technology.

(Logo:
http://photos.prnewswire.com/prnh/20140528/689557 )

    Higher and higher performance, speed, multifunctionality, reliability, and compact
size are required from today's microelectronics, to answer the customers' demands, while
the manufacturing costs must remain low to retain competitiveness.

    The Cost-Effective Interposer Consortium brings together frontline semiconductor
manufacturers and research institutes to address these challenges. Picosun joins forces
with e.g. IME, Inotera Memories, STATS ChipPAC Pte. Ltd., Teradyne Corporation, Tessolve
Semiconductor Pvt. Ltd., UMC, and Veeco Instruments to develop advanced, high volume
manufacturing solutions for cost-efficient packaging of the chip components.

    "We are happy to have Picosun as a member in the Cost-Effective Interposer Consortium.
This collaborative partnership will harness the expertise of our partners, including
Picosun's strong know-how in ALD, and IME's deep R&D experience to accelerate the
development and time-to-market of cost-efficient next-generation electronic devices," says
Prof. Dim-Lee Kwong, Executive Director of IME.

    "ALD is a central manufacturing method in today's semiconductor industries, and the
very technology that enables the future developments in the field.  For Picosun, this is
clearly our most important market area, where several world-leading IC industries already
rely on our production-proven ALD solutions. We are excited to collaborate with such a
number of prominent microelectronics industries and our long-time partner and valued
customer, IME, in the Cost-Effective Interposer Consortium," states Juhana Kostamo,
Managing Director of Picosun.

    A central approach to solve many key challenges in modern microelectronics development
is wafer-level 3D-integration of the components, which enables continued downscaling of
the chip size while retaining high performance and reliability. Cost savings are obtained
when larger number of chips can be manufactured on the same wafer. ALD is a key technology
to realize the ultra-thin active layers crucial for the chip component functionality, such
as high-k dielectrics for MIM (metal-insulator-metal) capacitors and high aspect ratio
liners.

    Picosun provides the most advanced ALD thin film coating technology to enable the
industrial leap into the future, with turn-key production solutions and unmatched
expertise in the field. Today, PICOSUN(TM) ALD equipment are in daily manufacturing use in
numerous major industries around the world. Picosun is based in Finland, with subsidiaries
in North America, Singapore, Taiwan, China, and Japan, and a world-wide sales and support
network. For more information visit http://www.picosun.com [http://www.picosun.com ].

Contact:

    Mr. Juhana Kostamo, Managing Director (email juhana.kostamo@picosun.com; tel.
+358-50-3699-565)

    Photo:
    http://photos.prnewswire.com/prnh/20140528/689557

Photo:http://photos.prnewswire.com/prnh/20140528/689557
http://photoarchive.ap.org/
Photo:http://photos.prnewswire.com/prnh/20140528/689557
http://photoarchive.ap.org/
Picosun Oy