ASE Labs
Welcome Guest. Please register or log in now. There are 638 people online (0 Friends).
  • Home
  • Articles
  • News
  • Forum
  • Register/Login

CEVA to Unveil its CEVA-X2 DSP at the Linley Mobile & Wearable Conference 2016

Poster: SySAdmin
Posted on July 18, 2016 at 6:14:01 AM
CEVA to Unveil its CEVA-X2 DSP at the Linley Mobile & Wearable Conference 2016

Company to present comprehensive LTE IP offerings, scaling from wearables through to LTE-Advanced-Pro and 5G at the conference, centered on the new CEVA-X2 DSP for PHY control

MOUNTAIN VIEW, Calif., July 18, 2016 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that it will unveil the CEVA-X2 DSP targeting multi-RAT PHY control and other advanced modem workloads at the upcoming Linley Mobile & Wearables Conference 2016. CEVA's presentation at the conference will give an in-depth insight into the Company's comprehensive portfolio of LTE and associated IPs, scalable from low-power wearables through to high-performance LTE-Advanced Pro and 5G smartphones. In addition to the CEVA-X2 scalar DSP, CEVA's offerings include CEVA-XC vector DSPs, associated function-specific accelerators, optimized firmware and software reference chains.

The two-day conference will take place on July 26 - 27 in Santa Clara, California, with CEVA's presentation scheduled for Session 1: "The Road to 5G Wireless" on July 26. More information can be found here.

Linley Gwennap, principal analyst of the Linley Group, commented: "CEVA has a long and successful heritage in DSP IP for LTE, and in fact, powered the first-ever LTE phone launched in the United States in 2010. In the intervening years, they have consistently advanced their LTE capabilities by adding specialized DSPs for control and data planes and augmented these with essential hardware and software IPs that improve performance and accelerate time-to-market for their customers. As a result, CEVA is well-positioned for the future with a single, coherent portfolio of LTE reference architectures for LTE-Advanced-Pro use cases, from IoT through to smartphones and beyond."

The CEVA-X2 is designed for specific LTE-Advanced-Pro and 5G use cases where the emphasis of the DSP is PHY control processing. For example, where the PHY Datapath tasks such as per-channel measurement and decoding are not required to run on the DSP, the CEVA-X2 offers a 30%-65% better die size efficiency and 10%-25% better power efficiency compared to CEVA-X4 DSP. The CEVA-X2 is also ideal to run both the PHY and MAC for a range of other communication standards, including IEEE 802.15.4g, ZigBee, Thread and power line communications (PLC), combining power efficiency with minimal die area for such use cases.

Michael Boukaya, vice president and general manager, Wireless Business Unit at CEVA, commented: "The NEW CEVA-X architecture framework addresses the DSP 'design gap' that exists for companies developing next-generation modems, including those targeting LTE-Advanced Pro and 5G. Many existing DSP architectures simply don't have the performance to tackle these advanced use cases efficiently. The CEVA-X2 brings a host of powerful features that address the key challenges for multi-RAT PHY control processing, ensuring outstanding performance and power efficiency for even the most complex use cases."

About CEVA-X2
The CEVA-X2 is the second DSP in The NEW CEVA-X family, offering a smaller and more power efficient alternative to the CEVA-X4 for use cases where the emphasis is on PHY control processing. The CEVA-X2 features a 64-bit SIMD data path and support for five-way VLIW instructions, together with a ten-stage pipeline and support for both fixed- and floating-point operations. The DSP is equipped with high-end features to compete with the best off-the-shelf controllers, including a dedicated 32-bit zero-latency Instruction Set Architecture (ISA), 32-bit hardware division and multiplication, dynamic branch prediction and ultra-fast context switching. For more information on The NEW CEVA-X family, visit http://www.ceva-dsp.com/CEVA-X-Family

About CEVA, Inc.
CEVA is the leading licensor of signal processing IP for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, computer vision and computational photography for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (Smart and Smart Ready), Wi-Fi (802.11 a/b/g/n/ac up to 4x4) and serial storage (SATA and SAS). Visit us at http://www.ceva-dsp.com and follow us on Twitter, YouTube and LinkedIn.

Logo - http://photos.prnewswire.com/prnh/20120808/SF53702LOGO

SOURCE  CEVA, Inc.

Photo:http://photos.prnewswire.com/prnh/20120808/SF53702LOGO
http://photoarchive.ap.org/
Photo:http://photos.prnewswire.com/prnh/20120808/SF53702LOGO
http://photoarchive.ap.org/
CEVA, Inc.

CONTACT: CEVA, Richard Kingston, CEVA, Inc., 650-417-7976, richard.kingston@ceva-dsp.com ; Pinnacle Marketing Communications Ltd, Simon Flatt, +44 20 8869 9229, simon.flatt@pinnaclemarcom.com

Web Site: http://www.ceva-dsp.com
 
Print This Entry
Tags PR Press Release
Related Articles
  • Huntkey Has Launched Its New Power Strips with USB Chargers on Amazon US
  • Inspur Releases TensorFlow-Supported FPGA Compute Acceleration Engine TF2
  • Hot Pepper Introduces Spicy New Smartphones in US Markets
  • Sharp Introduces New Desktop Printers For The Advanced Office
  • DJI Introduces Mavic 2 Pro And Mavic 2 Zoom: A New Era For Camera Drones
Login
Welcome Guest. Please register or log in now.
Forgot your password?
Navigation
  • Home
  • Articles
  • News
  • Register/Login
  • Shopping
  • ASE Forums
  • Anime Threads
  • HardwareLogic
  • ASE Adnet
Latest News
  • Kingston HyperX Cloud 2 Pro Gaming Headset Unboxing
  • Synology DS415+ Unboxing
  • D-Link DCS-5020L Wireless IP Pan/Tilt IP Camera
  • Actiontec WiFi Powerline Network Extender Kit Unboxing
  • Durovis Dive Unboxing
  • Bass Egg Verb Unboxing
  • Welcome to the new server
  • Gmail Gets Optional Preview Pane
  • HBO Go on Consoles
  • HP Touchpad Update
Latest Articles
  • D-Link Exo AC2600 Smart Mesh Wi-Fi Router DIR-2660-US
  • HyperX Double Shot PBT Keys
  • Avantree ANC032 Wireless Active Noise Cancelling Headphones
  • ScharkSpark Beginner Drones
  • HyperX Alloy FPS RGB Mechanical Gaming Keyboard
  • D-Link DCS-8300LH Full HD 2-Way Audio Camera
  • Contour Unimouse Wireless Ergonomic Mouse
  • HyperX Cloud Alpha Pro Gaming Headset
  • Linksys Wemo Smart Home Suite
  • Fully Jarvis Adjustable Standing Desk
Latest Topics
  • Hello
  • Welcome to the new server at ASE Labs
  • Evercool Royal NP-901 Notebook Cooler at ASE Labs
  • HyperX Double Shot PBT Keys at ASE Labs
  • Avantree ANC032 Wireless Active Noise Cancelling Headphones at ASE Labs
  • ScharkSpark Beginner Drones at ASE Labs
  • HyperX Alloy FPS RGB Mechanical Gaming Keyboard at ASE Labs
  • D-Link DCS-8300LH Full HD 2-Way Audio Camera at ASE Labs
  • Kingston SDX10V/128GB SDXC Memory at ASE Labs
  • What are you listening to now?
  • Antec Six Hundred v2 Gaming Case at HardwareLogic
  • Sans Digital TR5UTP 5-Bay RAID Tower at HardwareLogic
  • Crucial Ballistix Smart Tracer 6GB PC3-12800 BL3KIT25664ST1608OB at HardwareLogic
  • Cooler Master Storm Enforcer Mid-Tower Gaming Case at HardwareLogic
  • Arctic M571-L Gaming Laser Mouse at ASE Labs
  • Contour Unimouse Wireless Ergonomic Mouse at ASE Labs
Advertisement
Advertisement
Press Release
  • Huntkey Has Launched Its New Power Strips with USB Chargers on Amazon US
  • Inspur Releases TensorFlow-Supported FPGA Compute Acceleration Engine TF2
  • Hot Pepper Introduces Spicy New Smartphones in US Markets
  • Sharp Introduces New Desktop Printers For The Advanced Office
  • DJI Introduces Mavic 2 Pro And Mavic 2 Zoom: A New Era For Camera Drones
  • DJI Introduces Mavic 2 Pro And Mavic 2 Zoom: A New Era For Camera Drones
  • Fujifilm launches "instax SQUARE SQ6 Taylor Swift Edition", designed by instax global partner Taylor Swift
  • Huawei nova 3 With Best-in-class AI Capabilities Goes on Sale Today
  • Rand McNally Introduces Its Most Advanced Dashboard Camera
  • =?UTF-8?Q?My_Size_to_Showcase_Its_MySizeId=E2=84=A2_Mobil?= =?UTF-8?Q?e_Measurement_Technology_at_CurvyCon_NYC?=
Home - ASE Publishing - About Us
© 2010 Aron Schatz (ASE Publishing) [Queries: 16 (8 Cached)] [Rows: 292 Fetched: 35] [Page Generation time: 0.012033939361572]