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Thermal Engineering Associates Introduces The TMM-100
NEW TEMPERATURE MEASUREMENT SYSTEM
SANTA CLARA, Calif., Oct. 27, 2015 /PRNewswire/ -- Thermal Engineering Associates introduces a new temperature measurement instrument, called the TMM-100, for thermal evaluation and testing applications. The self contained TMM-100 module accepts diode, thermocouple and thermistor temperature sensors. The USB-connected instrument is supplied with Windows(TM) 7, 8 & 10 compatible software that provides for sensor measurement on a cyclic basis and for data logging of all measured values. LabVIEW((TM)) Virtual Instrument (VI) drivers are available as an extra cost option for users that wish to incorporate the TMM-100 into an application-specific measurement environment.
The TMM-100 has 8 channels for measuring diode voltage used in temperature measurements. These channels have precise 1.0mA current sources, isolated from each other. It also has two integrated Type-T thermocouple measurement circuits and two 10K Ohm NTC thermistor measurement circuits. The thermistor channels have 100uA current sources. For making accurate differential voltage measurements, the TMM-100 diode readings have 1mv resolution and both the thermocouple and thermistor have 0.1 degree C resolution.
Finally, with the LabVIEW((TM)) VI option, users can create control software to allow multipleTMM-100 units to collect data simultaneously on as many sensor channels as needed.
For more information and/or a product data sheet, contact TEA (info@thermengr.com).
About Thermal Engineering Associates:
TEA's president, Bernie Siegal, have been providing thermal test and measurement hardware, software, and consulting services since 1973. Siegal has been chairman of the JEDEC JC15 committee and is the principle author of many MILSTD 750 thermal test methods. All major semiconductor companies, packaging companies, and many system level OEMs have utilized TEA equipment and/or services during its long history. Siegal is a founding member of IEEE SEMI-THERM and has delivered numerous papers and articles on thermal testing, simulation, and evaluation methods and techniques and is frequently sought out as a lecturer and expert in the field. http://www.thermengr.net
SOURCE Thermal Engineering Associates
Thermal Engineering Associates
CONTACT: Media Contact: Bill Ribble, bribble@thermengr.net
Web Site: http://www.thermengr.net
Thermal Engineering Associates Introduces The TMM-100
NEW TEMPERATURE MEASUREMENT SYSTEM
SANTA CLARA, Calif., Oct. 27, 2015 /PRNewswire/ -- Thermal Engineering Associates introduces a new temperature measurement instrument, called the TMM-100, for thermal evaluation and testing applications. The self contained TMM-100 module accepts diode, thermocouple and thermistor temperature sensors. The USB-connected instrument is supplied with Windows(TM) 7, 8 & 10 compatible software that provides for sensor measurement on a cyclic basis and for data logging of all measured values. LabVIEW((TM)) Virtual Instrument (VI) drivers are available as an extra cost option for users that wish to incorporate the TMM-100 into an application-specific measurement environment.
The TMM-100 has 8 channels for measuring diode voltage used in temperature measurements. These channels have precise 1.0mA current sources, isolated from each other. It also has two integrated Type-T thermocouple measurement circuits and two 10K Ohm NTC thermistor measurement circuits. The thermistor channels have 100uA current sources. For making accurate differential voltage measurements, the TMM-100 diode readings have 1mv resolution and both the thermocouple and thermistor have 0.1 degree C resolution.
Finally, with the LabVIEW((TM)) VI option, users can create control software to allow multipleTMM-100 units to collect data simultaneously on as many sensor channels as needed.
For more information and/or a product data sheet, contact TEA (info@thermengr.com).
About Thermal Engineering Associates:
TEA's president, Bernie Siegal, have been providing thermal test and measurement hardware, software, and consulting services since 1973. Siegal has been chairman of the JEDEC JC15 committee and is the principle author of many MILSTD 750 thermal test methods. All major semiconductor companies, packaging companies, and many system level OEMs have utilized TEA equipment and/or services during its long history. Siegal is a founding member of IEEE SEMI-THERM and has delivered numerous papers and articles on thermal testing, simulation, and evaluation methods and techniques and is frequently sought out as a lecturer and expert in the field. http://www.thermengr.net
SOURCE Thermal Engineering Associates
Thermal Engineering Associates
CONTACT: Media Contact: Bill Ribble, bribble@thermengr.net
Web Site: http://www.thermengr.net