Axcelis 'Purion XE' High Energy Implanter Selected By Leading Chipmaker For Advanced Nand Flash Device Development
Poster: SySAdmin
Posted on October 6, 2015 at 7:21:01 AM
Axcelis 'Purion XE' High Energy Implanter Selected By Leading Chipmaker For Advanced Nand Flash Device Development
Dynamic Growth in Advanced Flash Devices Drives Need for More Precise Doping & Angle Control
BEVERLY, Mass., Oct. 6, 2015 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced that it has received an order for the Purion XE(TM) high energy implanter from a major chipmaker in the Asia Pacific Region. The system will be used to support the development of next generation VNAND Flash devices in the chipmaker's premier research center. The system is scheduled to ship in the fourth quarter.
http://photos.prnewswire.com/prnvar/20130905/NE75070LOGO
John Aldeborgh, executive vice president, customer operations, said, "We are very excited to be selected by this R&D center to develop their next generation devices. The Purion XE will be a key element of this customer's process development efforts. As cloud based solutions and mobile devices increasingly become a part of daily life, the need for cost efficient and reliable 3D NAND memory devices is expected to grow considerably. We see significant opportunity for the Purion XE as adoption accelerates."
Bill Bintz, executive vice president, marketing and engineering, commented, "Our expertise in high energy implant technology has resulted in our ability to proactively address the emerging needs of the advanced flash memory market. The Purion XE was selected over competitive systems because of its ability to provide the most precise dopant placement, including exacting angle control, which is critical to ensure high levels of performance and yield in the customer's new 3D processes."
The Purion Platform
The Purion platform redefines the ion implanter application space, delivering unmatched purity, precision and productivity to enhance customers' device performance and yield. On this platform, Axcelis has built the industry's first complete implant product solution designed specifically for advanced planar and 3D devices while providing the most flexible and productive manufacturing capability. This cross-product platform architecture is designed to drive manufacturing flexibility and lower the total cost of fab operations. All Purion implanters incorporate Axcelis' industry leading Purion Contamination Shield(TM) Defense System, for unsurpassed implant quality, so even the most sensitive devices can realize optimized device performance. The platform's proprietary Purion Vector(TM) dose and angle control system, and constant focal length scanning deliver the most precise and repeatable dopant placement available today. The platform's superior beam current performance combined with the Purion(TM) 500wph end station provides the industry's highest productivity. The Purion platform includes the Purion M(TM) medium current implanter, the Purion H(TM) high current implanter, and the Purion XE(TM) high energy implanter.
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 35 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at http://www.axcelis.com.
CONTACTS:
Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552
Logo - http://photos.prnewswire.com/prnh/20130905/NE75070LOGO
SOURCE Axcelis Technologies, Inc.
Photo:http://photos.prnewswire.com/prnh/20130905/NE75070LOGO
http://photoarchive.ap.org/
Photo:http://photos.prnewswire.com/prnh/20130905/NE75070LOGO
http://photoarchive.ap.org/
Axcelis Technologies, Inc.
Web Site: http://www.axcelis.com
Dynamic Growth in Advanced Flash Devices Drives Need for More Precise Doping & Angle Control
BEVERLY, Mass., Oct. 6, 2015 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced that it has received an order for the Purion XE(TM) high energy implanter from a major chipmaker in the Asia Pacific Region. The system will be used to support the development of next generation VNAND Flash devices in the chipmaker's premier research center. The system is scheduled to ship in the fourth quarter.
http://photos.prnewswire.com/prnvar/20130905/NE75070LOGO
John Aldeborgh, executive vice president, customer operations, said, "We are very excited to be selected by this R&D center to develop their next generation devices. The Purion XE will be a key element of this customer's process development efforts. As cloud based solutions and mobile devices increasingly become a part of daily life, the need for cost efficient and reliable 3D NAND memory devices is expected to grow considerably. We see significant opportunity for the Purion XE as adoption accelerates."
Bill Bintz, executive vice president, marketing and engineering, commented, "Our expertise in high energy implant technology has resulted in our ability to proactively address the emerging needs of the advanced flash memory market. The Purion XE was selected over competitive systems because of its ability to provide the most precise dopant placement, including exacting angle control, which is critical to ensure high levels of performance and yield in the customer's new 3D processes."
The Purion Platform
The Purion platform redefines the ion implanter application space, delivering unmatched purity, precision and productivity to enhance customers' device performance and yield. On this platform, Axcelis has built the industry's first complete implant product solution designed specifically for advanced planar and 3D devices while providing the most flexible and productive manufacturing capability. This cross-product platform architecture is designed to drive manufacturing flexibility and lower the total cost of fab operations. All Purion implanters incorporate Axcelis' industry leading Purion Contamination Shield(TM) Defense System, for unsurpassed implant quality, so even the most sensitive devices can realize optimized device performance. The platform's proprietary Purion Vector(TM) dose and angle control system, and constant focal length scanning deliver the most precise and repeatable dopant placement available today. The platform's superior beam current performance combined with the Purion(TM) 500wph end station provides the industry's highest productivity. The Purion platform includes the Purion M(TM) medium current implanter, the Purion H(TM) high current implanter, and the Purion XE(TM) high energy implanter.
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 35 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at http://www.axcelis.com.
CONTACTS:
Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552
Logo - http://photos.prnewswire.com/prnh/20130905/NE75070LOGO
SOURCE Axcelis Technologies, Inc.
Photo:http://photos.prnewswire.com/prnh/20130905/NE75070LOGO
http://photoarchive.ap.org/
Photo:http://photos.prnewswire.com/prnh/20130905/NE75070LOGO
http://photoarchive.ap.org/
Axcelis Technologies, Inc.
Web Site: http://www.axcelis.com