Leading Equipment Manufacturer Selects JVX7300RF-W for Process Development of Advanced Wafer Level Packaging

Leading Equipment Manufacturer Selects JVX7300RF-W for Process Development of Advanced Wafer Level Packaging

MIGDAL HAEMEK, Israel, August 19, 2015 /PRNewswire/ --

    Jordan Valley announces the selection of their advanced JVX7300RF-W, by a world
leading process equipment manufacturer. The tool was selected following extensive
evaluation of tool capability, performance and productivity for development and customers'
demonstration of advanced wafer level packaging and thin-film applications. 

    Jordan Valley, a leading supplier of X-ray based in-line metrology systems for
advanced semiconductor manufacturers, today announced that it received an order from a
market-leading equipment manufacturer, selecting the new JVX7300RF-W metrology system for
advanced process development and control.

    The JVX7300RF-W system offers invaluable in-line metrology combining both small spot
XRF and first principle XRR and providing solutions for multilayer complex 2D and 3D metal
stacks, as well as ultra-thin layers (<10A) and small pads or micro-bumps.

    The JVX7300RF-W delivers high ROI and low CoO for its inline metrology of next
generation Wafer Level Packaging (WLP) advanced micro-bump process development and control,
allowing high throughput non-destructive thickness and composition measurements.

    JVX7300RF-W is the successor to the production proven JVX6200iRF with extended
capabilities and significant productivity improvements. The 7300RF-W allows metrology on
smaller features necessary to adhere to the industry roadmaps and the WLP segment's unique
needs among others.

    "This order marks the true need of JVX7300RF-W for the development and control for
advanced WLP and other thin-films" stated Asaf Shlomo, Jordan Valley's Product Marketing
Manager. "This engagement from a leading equipment manufacturer is further acknowledgement
of the high value of the JVX7300RF-W tool to provide advanced WLP and plating process
metrology solutions," added Shlomo.

    Isaac Mazor, Jordan Valley CEO, noted, "We are proud of this win, to be part of center
of excellence of another leading supplier, where we will demo our tool as part of advanced
tool set for our mutual customers."

    About the JVX7300RF-W production metrology tool.

    The JVX7300RF-W is a production worthy X-ray metrology tool combining small-spot XRF
and XRR measurement channels. The tool targets both FEOL applications for nodes at 20nm
and lower, and advanced WLP manufacturing. The tool is configured for full fab automation
and is SEMI S2/S8 and CE certified.

    About Jordan Valley Semiconductors Ltd.  

    Jordan Valley Semiconductors (JVS) is the leader in X-ray metrology and defect
detection tools for the semiconductor industry. Jordan Valley's tools are fully automated
non-contacting and non-destructive tools designed for production control on patterned or
blanket wafers.

    The company offers the semiconductor industry the most comprehensive portfolio of
advanced metrology and defect inspection tools, based on X-ray technologies such as XRR
(X-ray reflectometry), XRF (X-ray fluorescence), XRD (X-ray diffraction) and others.

    Jordan Valley's investors include Clal Industries and Investments Ltd. (TASE: CII),
Intel Capital (NASDAQ: INTC) and Elron Electronics Industries Ltd. (TASE: ELRN). With
headquarters in Migdal Haemek, Israel, the company has subsidiaries in Durham UK, Austin
TX USA, Hsin-Chu Taiwan, Suwon Korea and other offices and sales representatives
worldwide.

       
         
        For more information: 
        Asaf Shlomo 
        Product Marketing Manager 
        Tel: +972-4654-3666 
        asaf.shlomo@jordanvalley.com 
        http://www.jvsemi.com 

     

Jordan Valley