AT&S Offers New Outstanding Embedded Power Electronics Solutions

AT&S Offers New Outstanding Embedded Power Electronics Solutions

LEOBEN, Austria, December 22, 2014 /PRNewswire/ --

       
        - AT&S achieved first disruptive technology for power electronics solutions
          for automotive and industrial applications
        - First reference designs show significant miniaturisation up to 50% for power
          modules
        - Power applications in different power classes in the range from 50 W to 50 kW
        - 50 W power applications are ready for industrialisation

    AT&S [http://www.ats.net ] is the leading provider for Embedded Component Packaging
Solutions. Its patented ECP(R) technology enables further miniaturisation while improving
performance. Due to its constant technology development and strong partnerships, AT&S has
now achieved outstanding results in the field of power electronics. This solution provides
a significant increase in efficiency and performance for Industrial and Automotive
Applications.

    (Logo:
http://photos.prnewswire.com/prnh/20141222/721394 )

    Together with the EmPower consortium consisting of important industrial players and
scientific partners, the development of embedded power packages is now ready for
industrialisation. After 18 months of project work, the first impressive results have
become visible especially when benchmarking with existing packaging solutions:

    Reference designs have already been produced and show miniaturisation levels of up to
50% for power modules. With the new embedding packaging concepts, an efficiency increase
through reduction of power losses and reduced thermal resistances has been demonstrated.
New plating equipment for wafer level plating has been developed in order to realise
double sided copper plated power dies. This enables a new supply chain for embedded power
devices and new packaging solutions.

    Based on this positive development, leading companies from the Automotive, Industrial
& Semiconductor industrial sectors are now on their way to industrialising these new
package solutions. Power applications (e.g DC/AC, renewable power solutions) classified in
different power ranges from 50 W to 50 kW are targets on the industrialisation plan.

    Andreas Gerstenmayer [http://www.ats.net/blog/team/andreas-gerstenmayer ], CEO AT&S:
"The increasing demand in power electronics confirms our strategy to focus on innovative
and efficient methods to optimise the use of energy. Based on the results achieved, AT&S
is now able to offer customers and potential customers in the Automotive, Industrial as
well as in the Semiconductor industry our innovative embedded power electronic packaging
solutions."

    The EmPower consortium consists of the following members:

       
        - AT&S - Austria
        - Continental - Germany
        - STMicroelectronics - France/Italy
        - TU Wien - Austria
        - TU Berlin - Germany
        - Atotech - Germany
        - Ilfa - Germany
        - Fundico - Belgium

    About AT&S

    AT&S is the European market leader and one of the leading manufacturers of high-value
printed circuit boards. For more information [http://www.ats.net/company ]

    Twitter [https://twitter.com/ATS_IR_PR ]

    YouTube [https://www.youtube.com/user/ATundS ]

       
        Press contact
        Christina Schuller, Head of Corporate Communications
        AT & S Austria Technologie & Systemtechnik AG
        +43-(0)3842-200-5908, c.schuller@ats.net, http://www.ats.net

    Please note that only the English version is binding.

    Photo:
    http://photos.prnewswire.com/prnh/20141222/721394

Photo:http://photos.prnewswire.com/prnh/20141222/721394
http://photoarchive.ap.org/
AT&S Austria Technologie & Systemtechnik AG