Thermal Engineering Associates Offers Increased Power Density With Small TTC-1001 Thermal Test Chip
Poster: SySAdmin
Posted on November 19, 2014 at 6:07:01 AM
Thermal Engineering Associates Offers Increased Power Density With Small TTC-1001 Thermal Test Chip
SANTA CLARA, Calif., Nov. 19, 2014 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announced that its TTC-1001 Thermal Test Chip (TTC) has capability of supplying a power density of 261W/cm(2 )for performing Thermal Interface Material (TIM) testing, evaluating package thermal characteristics, and other applications requiring high density thermal flux. The TTC-1001 is a 1mm square Unit Cell design sold in wafer or chip form which can dissipate 300W over a 10x10 array (~1 cm square, each cell dissipating up to 3W).
As an example of high thermal density applications, TTC-1001 chips are used to simulate heat flux generation from high power transistors, small microprocessors and application-specific ICs (ASICS). The small cell size can easily be arrayed for SiN and GaAs transistors and RF Amplifier heat flux simulation.
The TTC-1001 may be ordered as a wire bond or bumped wafer with no minimum quantities. TEA has a wide range of backside metal options for various attachment methods and a variety of bump composition options. TEA will also dice wafers to customer specifications and requirements.
The TTC-1001 is available for immediate customization to customer needs and shipment lead times depend upon customization options.
About Thermal Engineering Associates:
TEA and its president, Bernie Siegal, have been providing thermal test and measurement hardware, software, and consulting services since 1973. Siegal has been chairman of the JEDEC JC15 committee and is the principle author of many MILSTD 750 thermal test methods. All major semiconductor companies, packaging companies, and many system level OEMs have utilized TEA equipment and/or services during its long history. Siegal is a founding member of IEEE SEMI-THERM and has delivered numerous papers and articles on thermal testing, simulation, and evaluation methods and techniques and is frequently sought out as a lecturer and expert in the field. http://www.thermengr.net
SOURCE Thermal Engineering Associates, Inc.
Thermal Engineering Associates, Inc.
CONTACT: Bill Ribble, bill@ribble.net, (408) 202-3539
Web Site: http://www.thermengr.net
SANTA CLARA, Calif., Nov. 19, 2014 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announced that its TTC-1001 Thermal Test Chip (TTC) has capability of supplying a power density of 261W/cm(2 )for performing Thermal Interface Material (TIM) testing, evaluating package thermal characteristics, and other applications requiring high density thermal flux. The TTC-1001 is a 1mm square Unit Cell design sold in wafer or chip form which can dissipate 300W over a 10x10 array (~1 cm square, each cell dissipating up to 3W).
As an example of high thermal density applications, TTC-1001 chips are used to simulate heat flux generation from high power transistors, small microprocessors and application-specific ICs (ASICS). The small cell size can easily be arrayed for SiN and GaAs transistors and RF Amplifier heat flux simulation.
The TTC-1001 may be ordered as a wire bond or bumped wafer with no minimum quantities. TEA has a wide range of backside metal options for various attachment methods and a variety of bump composition options. TEA will also dice wafers to customer specifications and requirements.
The TTC-1001 is available for immediate customization to customer needs and shipment lead times depend upon customization options.
About Thermal Engineering Associates:
TEA and its president, Bernie Siegal, have been providing thermal test and measurement hardware, software, and consulting services since 1973. Siegal has been chairman of the JEDEC JC15 committee and is the principle author of many MILSTD 750 thermal test methods. All major semiconductor companies, packaging companies, and many system level OEMs have utilized TEA equipment and/or services during its long history. Siegal is a founding member of IEEE SEMI-THERM and has delivered numerous papers and articles on thermal testing, simulation, and evaluation methods and techniques and is frequently sought out as a lecturer and expert in the field. http://www.thermengr.net
SOURCE Thermal Engineering Associates, Inc.
Thermal Engineering Associates, Inc.
CONTACT: Bill Ribble, bill@ribble.net, (408) 202-3539
Web Site: http://www.thermengr.net