EV Group Next-Gen Nanoimprint Lithography Technology Targets Photonics, LED And Bioengineered Device Production

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EV Group Next-Gen Nanoimprint Lithography Technology Targets Photonics, LED And Bioengineered Device Production

SmartNIL(TM) large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches

ST. FLORIAN, Austria, Oct. 21, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its SmartNIL(TM) large-area nanoimprint lithography (NIL) process. Available on all EV Group NIL platforms, including mask aligners as well as the industry benchmark EVG(®)720 and newly available EVG(®)7200 UV-NIL systems, SmartNIL provides a low-cost, large-area and high-volume-manufacturing solution for a variety of advanced devices, including:

    --  Photonic-based devices such as light-emitting diodes (LEDs), lasers and
        photovoltaics
    --  Micro arrays and nano-devices for medical devices and bioengineered
        applications
    --  Advanced storage media, including newly emerging forms of non-volatile
        memory (NVM)

http://photos.prnewswire.com/prnvar/20141020/153188

"SmartNIL is built on more than15 years of NIL experience at EVG that includes the largest installed base of NIL systems worldwide, and is the only NIL technology currently used in high-volume manufacturing on substrates up to 200 mm today," stated Paul Lindner, executive technology director at EV Group. "With our new EVG7200 UV-NIL system, which has industry-leading resolution down to 20 nm in volume production, EVG brings the advanced soft stamp and imprint capability of SmartNIL to larger substrates and smaller geometries. This enables our customers to achieve even greater cost-of-ownership (CoO) benefits and realize the full manufacturing potential of nanoimprint lithography."

Benefits of SmartNIL

    --  Photonic devices, such as photovoltaics, LEDs, laser diodes and optical
        sensors, rely on the nano-scale manipulation of light to achieve optimal
        performance. This light manipulation can be tailored through the use of
        nano-scale structures such as photonic crystals, gratings, phase-shift
        structures and wave guides
    --  In bioengineered applications, nano-scale manufacturing processes are a
        requirement, since most biologic events begin at the nanometer scale
    --  For both applications, traditional writing methods for producing
        nano-scale features either have extremely low throughput and, therefore,
        cannot be easily scaled up for cost-efficient production (such as
        electron-beam writing) or have sufficient throughput but are too
        cost-prohibitive, such as stepper systems for optical lithography
    --  Certain photonic and bioengineered applications can also realize greater
        throughput and CoO benefits from the ability to pattern 3D structures or
        different height levels in a single step--which can best be accomplished
        with a soft-stamp UV-NIL approach
    --  SmartNIL coupled with EV Group's EVG720 system (for 150-mm substrates),
        which is in use at multiple leading device manufacturers' fabs, and the
        new EVG7200 system (for 200-mm substrates) provides the optimal
        combination of high resolution, high-alignment accuracy and high
        throughput in a cost-effective platform required for volume production
        for photonic and bioengineered device applications
Key SmartNIL Technology Features

    --  Large full-field imprint area (up to 200 mm)
    --  Fastest full-substrate UV-NIL solution for high-volume-manufacturing
        applications (>40 substrates per hour for 200-mm substrates)
    --  Integrated soft stamp fabrication technology reduces tool footprint and
        provides fast replication (less than 10 minutes versus 24 hours or more
        with competing technologies)
    --  Enables patterning on highly topographical structures; less sensitive to
        bowed and warped wafers
    --  Optimized releasing properties extend the lifetime of the stamp
    --  Self-cleaning properties reduce particle contamination and improve
        overall processing yields
    --  Room-temperature process avoids thermal mismatch and long-range
        structure distortion for improved alignment accuracy
About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at http://www.EVGroup.com.

Photo - http://photos.prnewswire.com/prnh/20141020/153188

To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/ev-group-next-gen-nanoimprint-lithography-technology-targets-photonics-led-and-bioengineered-device-production-603884717.html

SOURCE  EV Group

Photo:http://photos.prnewswire.com/prnh/20141020/153188
http://photoarchive.ap.org/
EV Group

CONTACT: Clemens Schütte, Director, Marketing and Communications, EV Group, Tel: +43 7712 5311 0, E-mail: Marketing@EVGroup.com; or David Moreno, Vice President, MCA, Inc., Tel: +1.650.968.8900, ext. 125, E-mail: dmoreno@mcapr.com

Web Site: http://www.evgroup.com

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