Toshiba Introduces New Low-Profile Photocouplers for IGBTs and Power MOSFETs
Poster: SySAdmin
Posted on September 5, 2014 at 9:14:01 AM
Toshiba Introduces New Low-Profile Photocouplers for IGBTs and Power MOSFETs
Rail-to-Rail Gate-Drive Photocouplers in SO6L Package Reduce Height by 54 Percent
IRVINE, Calif., Sept. 5, 2014 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced a new series of low-profile, rail-to-rail output gate-drive photocouplers for directly driving low- to medium-power IGBTs and power MOSFETs: the TLP5751, TLP5752 and TLP5754.
The TLP5751 offers a peak output current of +1.0A and can drive power MOSFETs and low-power IGBTs up to 20A. The +2.5A TLP5752 and +4.0A TLP5754 will drive power MOSFETs and IGBTs with current ratings to 80A and 100A, respectively. Operating temperature is from -40 degrees C to 110 degrees C, and target applications include home appliances, factory automation equipment and inverter designs that require high levels of isolation and stable operation across an extended temperature range.
All of the new photocouplers are housed in a low-profile SO6L package. This package is 54 percent smaller in terms of height than photocouplers that use a DIP8 package - and uses just 43 percent of the board mounting area. Despite their low height, the new photocouplers have a guaranteed creepage distance of 8mm and an isolation voltage of 5kV.
The TLP57xx devices offer rail-to-rail output, delivering stable operation and enhanced switching performance. Power supply voltage is from 15V to 30V and maximum supply current is 3.0mA.
The TLP5751, TLP5752 and TLP5754 are comprised of a GaAlAs infrared LED and integrated high-gain, high-speed photodetector, and feature an undervoltage lockout (UVLO) function. An internal Faraday shield ensures a guaranteed common-mode transient immunity of +35kV/ s. Maximum propagation delay time is rated at 150ns, and maximum propagation delay skew at 80ns.
For more details, samples and pricing information, please contact your local Toshiba Sales Office.
*About Toshiba Corp. and TAEC
About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, April 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at http://www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec/.
© 2014 Toshiba America Electronic Components, Inc. All rights reserved.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
Editor's Note: Images available for download from: http://www.toshiba.com/taec/news/press_releases/2014/opto_14_722.jsp
MEDIA CONTACT:
Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
dena@lages.com
SOURCE Toshiba America Electronic Components, Inc.
Toshiba America Electronic Components, Inc.
CONTACT: Rebecca Bueno, Toshiba America Electronic Components, Inc., Tel.: (949) 462-7885, rebecca.bueno@taec.toshiba.com
Web Site: http://www.toshiba.com/taec
Rail-to-Rail Gate-Drive Photocouplers in SO6L Package Reduce Height by 54 Percent
IRVINE, Calif., Sept. 5, 2014 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced a new series of low-profile, rail-to-rail output gate-drive photocouplers for directly driving low- to medium-power IGBTs and power MOSFETs: the TLP5751, TLP5752 and TLP5754.
The TLP5751 offers a peak output current of +1.0A and can drive power MOSFETs and low-power IGBTs up to 20A. The +2.5A TLP5752 and +4.0A TLP5754 will drive power MOSFETs and IGBTs with current ratings to 80A and 100A, respectively. Operating temperature is from -40 degrees C to 110 degrees C, and target applications include home appliances, factory automation equipment and inverter designs that require high levels of isolation and stable operation across an extended temperature range.
All of the new photocouplers are housed in a low-profile SO6L package. This package is 54 percent smaller in terms of height than photocouplers that use a DIP8 package - and uses just 43 percent of the board mounting area. Despite their low height, the new photocouplers have a guaranteed creepage distance of 8mm and an isolation voltage of 5kV.
The TLP57xx devices offer rail-to-rail output, delivering stable operation and enhanced switching performance. Power supply voltage is from 15V to 30V and maximum supply current is 3.0mA.
The TLP5751, TLP5752 and TLP5754 are comprised of a GaAlAs infrared LED and integrated high-gain, high-speed photodetector, and feature an undervoltage lockout (UVLO) function. An internal Faraday shield ensures a guaranteed common-mode transient immunity of +35kV/ s. Maximum propagation delay time is rated at 150ns, and maximum propagation delay skew at 80ns.
For more details, samples and pricing information, please contact your local Toshiba Sales Office.
*About Toshiba Corp. and TAEC
About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, April 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at http://www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec/.
© 2014 Toshiba America Electronic Components, Inc. All rights reserved.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
Editor's Note: Images available for download from: http://www.toshiba.com/taec/news/press_releases/2014/opto_14_722.jsp
MEDIA CONTACT:
Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
dena@lages.com
SOURCE Toshiba America Electronic Components, Inc.
Toshiba America Electronic Components, Inc.
CONTACT: Rebecca Bueno, Toshiba America Electronic Components, Inc., Tel.: (949) 462-7885, rebecca.bueno@taec.toshiba.com
Web Site: http://www.toshiba.com/taec