ASE Labs
Welcome Guest. Please register or log in now. There are 562 people online (0 Friends).
  • Home
  • Articles
  • News
  • Forum
  • Register/Login

Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit

Poster: SySAdmin
Posted on July 9, 2014 at 6:14:01 AM
Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit

Feature-rich, affordable platform enables OEMs to leverage SmartFusion2's lowest power consumption in its class, high reliability capabilities and best-in-class security to build highly differentiated products with significant time to market advantage

ALISO VIEJO, Calif., July 9, 2014 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the company's new leading-edge SmartFusion®2 SoC FPGA Evaluation Kit. The new SmartFusion2 Evaluation Kit is an easy-to-use, feature-rich, affordable platform designed to enable designers to quickly and easily accelerate evaluation or prototype their application. Utilizing Microsemi's mainstream SmartFusion2 FPGAs enables original equipment manufacturers (OEMs) to leverage the device's lowest power consumption in its class, high reliability capabilities and best-in-class security technology to build highly differentiated products that help them gain a significant time to market advantage.

http://photos.prnewswire.com/prnvar/20110909/MM66070LOGO

A prime example is that the SmartFusion2 Evaluation Kit allows for simplified development of transceiver I/O-based FPGA designs necessary in today's PCI Express (PCIe) and Gigabit Ethernet-based systems. For faster evaluation and prototyping, Microsemi's leading-edge evaluation board is small form-factor PCIe compliant, which can be used on any desktop PC or laptop with a PCIe slot. According to market research firm Infonetics, the carrier Ethernet market will grow to approximately $39 billion in 2017.

"Leveraging our experience as a leader in this market, Microsemi's new SmartFusion2 SoC FPGA Evaluation Kit is the ideal development platform for designers just starting to work with FPGA-based processors. We've made it easier to implement new designs because designers aren't starting from scratch," said Venkatesh Narayanan, director of software and systems engineering at Microsemi. "It is important for our OEMs to implement designs quickly and Microsemi's new kit provides the key mainstream features customers demand most, with a 25K LE SmartFusion2 mainstream FPGA and SERDES evaluation capabilities at a very affordable price point."

The kit offers a comprehensive set of features that include PCIe, Gigabit Ethernet, full-duplex SERDES SMA pairs, DDR memory, SPI Flash, USB On-The-Go and several expansion interfaces that create the needed flexibility for a wide range of application development. With purchase of the evaluation kit, developers also have access to Microsemi's full array of industry leading development resources such as reference designs and the ability to launch example application demonstrations.

For more information on Microsemi's SmartFusion2 SoC FPGA Evaluation Kit, visit http://www.microsemi.com/fpgaevaluationkit. Customers can also contact Microsemi's sales team at sales.support@microsemi.com.

About SmartFusion2 SoC FPGAs
SmartFusion2 SoC FPGAs integrate inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high performance communication interfaces, all on a single chip. Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications.

About Microsemi

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at http://www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its SmartFusion®2 SoC FPGA Evaluation Kit, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

Logo - http://photos.prnewswire.com/prnh/20110909/MM66070LOGO

SOURCE  Microsemi Corporation

Photo:http://photos.prnewswire.com/prnh/20110909/MM66070LOGO
http://photoarchive.ap.org/
Microsemi Corporation

CONTACT: Richard Round, Sr. Manager, Marketing Communications, 949.380.6135; Beth P. Quezada, Communications Specialist, 949.380.6102, Email: press@microsemi.com

Web Site: http://www.microsemi.com
 
Print This Entry
Tags PR Press Release
Related Articles
  • Huntkey Has Launched Its New Power Strips with USB Chargers on Amazon US
  • Inspur Releases TensorFlow-Supported FPGA Compute Acceleration Engine TF2
  • Hot Pepper Introduces Spicy New Smartphones in US Markets
  • Sharp Introduces New Desktop Printers For The Advanced Office
  • DJI Introduces Mavic 2 Pro And Mavic 2 Zoom: A New Era For Camera Drones
Login
Welcome Guest. Please register or log in now.
Forgot your password?
Navigation
  • Home
  • Articles
  • News
  • Register/Login
  • Shopping
  • ASE Forums
  • Anime Threads
  • HardwareLogic
  • ASE Adnet
Latest News
  • Kingston HyperX Cloud 2 Pro Gaming Headset Unboxing
  • Synology DS415+ Unboxing
  • D-Link DCS-5020L Wireless IP Pan/Tilt IP Camera
  • Actiontec WiFi Powerline Network Extender Kit Unboxing
  • Durovis Dive Unboxing
  • Bass Egg Verb Unboxing
  • Welcome to the new server
  • Gmail Gets Optional Preview Pane
  • HBO Go on Consoles
  • HP Touchpad Update
Latest Articles
  • D-Link Exo AC2600 Smart Mesh Wi-Fi Router DIR-2660-US
  • HyperX Double Shot PBT Keys
  • Avantree ANC032 Wireless Active Noise Cancelling Headphones
  • ScharkSpark Beginner Drones
  • HyperX Alloy FPS RGB Mechanical Gaming Keyboard
  • D-Link DCS-8300LH Full HD 2-Way Audio Camera
  • Contour Unimouse Wireless Ergonomic Mouse
  • HyperX Cloud Alpha Pro Gaming Headset
  • Linksys Wemo Smart Home Suite
  • Fully Jarvis Adjustable Standing Desk
Latest Topics
  • Hello
  • Welcome to the new server at ASE Labs
  • Evercool Royal NP-901 Notebook Cooler at ASE Labs
  • HyperX Double Shot PBT Keys at ASE Labs
  • Avantree ANC032 Wireless Active Noise Cancelling Headphones at ASE Labs
  • ScharkSpark Beginner Drones at ASE Labs
  • HyperX Alloy FPS RGB Mechanical Gaming Keyboard at ASE Labs
  • D-Link DCS-8300LH Full HD 2-Way Audio Camera at ASE Labs
  • Kingston SDX10V/128GB SDXC Memory at ASE Labs
  • What are you listening to now?
  • Antec Six Hundred v2 Gaming Case at HardwareLogic
  • Sans Digital TR5UTP 5-Bay RAID Tower at HardwareLogic
  • Crucial Ballistix Smart Tracer 6GB PC3-12800 BL3KIT25664ST1608OB at HardwareLogic
  • Cooler Master Storm Enforcer Mid-Tower Gaming Case at HardwareLogic
  • Arctic M571-L Gaming Laser Mouse at ASE Labs
  • Contour Unimouse Wireless Ergonomic Mouse at ASE Labs
Advertisement
Advertisement
Press Release
  • Huntkey Has Launched Its New Power Strips with USB Chargers on Amazon US
  • Inspur Releases TensorFlow-Supported FPGA Compute Acceleration Engine TF2
  • Hot Pepper Introduces Spicy New Smartphones in US Markets
  • Sharp Introduces New Desktop Printers For The Advanced Office
  • DJI Introduces Mavic 2 Pro And Mavic 2 Zoom: A New Era For Camera Drones
  • DJI Introduces Mavic 2 Pro And Mavic 2 Zoom: A New Era For Camera Drones
  • Fujifilm launches "instax SQUARE SQ6 Taylor Swift Edition", designed by instax global partner Taylor Swift
  • Huawei nova 3 With Best-in-class AI Capabilities Goes on Sale Today
  • Rand McNally Introduces Its Most Advanced Dashboard Camera
  • =?UTF-8?Q?My_Size_to_Showcase_Its_MySizeId=E2=84=A2_Mobil?= =?UTF-8?Q?e_Measurement_Technology_at_CurvyCon_NYC?=
Home - ASE Publishing - About Us
© 2010 Aron Schatz (ASE Publishing) [Queries: 16 (6 Cached)] [Rows: 292 Fetched: 197] [Page Generation time: 0.018838882446289]