NASA Makes High Temperature Chips

Aron Schatz
September 12, 2007

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NASA has developed Silicon Carbide ICs that can withstand very high heat. The new circuits can be used in high heat environments like jets and such.


The new silicon carbide differential amplifier integrated circuit chip may provide benefits to anything requiring long-lasting electronic circuits in very hot environments such as jets, spacecraft and industrial machinery. In particular, NASA said SiC applications will include energy storage, renewable energy, nuclear power, electrical drives. The use of the high temperature packaging and operation of SiC power modules for its power electronics equipment will bring about the benefits of increase in power density, reduction in heat sink requirements (thus smaller size and mass), and higher frequency operation that also results in lower mass for the filters and transformers.


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