SPTS Announce Sigma fxP PVD for 300 mm Power Device Manufacturing
Poster: SySAdmin
Posted on September 3, 2013 at 9:07:01 PM
SPTS Announce Sigma fxP PVD for 300 mm Power Device Manufacturing
Next generation system ready for power devices transitioning to large wafer formats
NEWPORT, England, September 4, 2013 /PRNewswire/ --
SPTS Technologies, a supplier of advanced wafer processing solutions for the global
semiconductor industry and related markets, today announced the launch of its Sigma fxP
physical vapor deposition (PVD) system for 300mm power device manufacturing. Available
system options include modules for frontside thick aluminum processing and backside metal
deposition on ultra-thin wafers. The new system is designed to address the technical
challenges customers face as they scale power PVD processes up to 300 mm wafer size.
(Logo:
http://photos.prnewswire.com/prnh/20130116/588621 )
In a discrete MOSFET power device, current passes through the silicon substrate so
electrical contacts are required on both sides of the wafer. Due to the high currents
involved, thick aluminum alloy layers are deposited on the frontside of the wafer
(typically > 4 microm rather than <1 microm for mainstream silicon interconnects).
However, depositing thick films puts unusually large heat loads on process chamber
hardware, potentially resulting in film contamination from outgassing chamber furniture.
This contamination can lead to the formation of aluminum whiskers/extrusions in the
growing film that can ultimately result in device killer defects. In traditional front end
fab deposition equipment, a common technique to mitigate this issue is to reduce film
deposition rates with a corresponding reduction on system productivity. However, the Sigma
fxP design overcomes that challenge without compromising throughput. Sigma fxP users
routinely deposit thick Al layers at rates >1.4 microm/min without any yield destroying
whiskers or extrusions.
With frontside processing complete, wafers are thinned down to 50 microm or less to
reduce 'on-state' resistance and solder metal layers are deposited on the backside. No
supporting carrier substrates are used and the ultra-thin, large area wafer will deform
under the influence of uncontrolled film stresses, with miss-handling a potential
consequence. The Sigma fxP carries thin wafer handling hardware and uses film deposition
stress control techniques to deliver high throughput processes with low wafer bow.
Currently, seven out of the top ten power device manufacturers, and all major
foundries use the Sigma fxP as the process tool of record for power PVD processing. With
power device manufacturing moving to 300mm format wafers, SPTS has successfully
transferred its market leading process knowledge and capability to the new platform.
"We are pleased to offer customers a complete solution for 300 mm Power PVD
processing," said Chris Jones, product marketing manager at SPTS. "Sigma fxP systems are
in full production for frontside thick Al and thin wafer backside processing. We are
prepared to support the IDMs and foundries as they make the transition from 150 and 200mm
wafer formats to 300mm."
About SPTS Technologies
SPTS Technologies (a Bridgepoint portfolio company) designs, manufactures, sells, and
supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced
packaging, LEDs, high speed RF on GaAs, and power management device markets. With
manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose,
California, the company operates across 19 countries in Europe, North America and
Asia-Pacific. For more information about SPTS Technologies, please visit
http://www.spts.com
Photo:
http://photos.prnewswire.com/prnh/20130116/588621
Photo:http://photos.prnewswire.com/prnh/20130116/588621
http://photoarchive.ap.org/
SPTS Technologies Ltd
CONTACT: Company Contact: Evelyn Tay, Tel: +44(0)7885-70-6565, Evelyn.Tay@spts.com
Next generation system ready for power devices transitioning to large wafer formats
NEWPORT, England, September 4, 2013 /PRNewswire/ --
SPTS Technologies, a supplier of advanced wafer processing solutions for the global
semiconductor industry and related markets, today announced the launch of its Sigma fxP
physical vapor deposition (PVD) system for 300mm power device manufacturing. Available
system options include modules for frontside thick aluminum processing and backside metal
deposition on ultra-thin wafers. The new system is designed to address the technical
challenges customers face as they scale power PVD processes up to 300 mm wafer size.
(Logo:
http://photos.prnewswire.com/prnh/20130116/588621 )
In a discrete MOSFET power device, current passes through the silicon substrate so
electrical contacts are required on both sides of the wafer. Due to the high currents
involved, thick aluminum alloy layers are deposited on the frontside of the wafer
(typically > 4 microm rather than <1 microm for mainstream silicon interconnects).
However, depositing thick films puts unusually large heat loads on process chamber
hardware, potentially resulting in film contamination from outgassing chamber furniture.
This contamination can lead to the formation of aluminum whiskers/extrusions in the
growing film that can ultimately result in device killer defects. In traditional front end
fab deposition equipment, a common technique to mitigate this issue is to reduce film
deposition rates with a corresponding reduction on system productivity. However, the Sigma
fxP design overcomes that challenge without compromising throughput. Sigma fxP users
routinely deposit thick Al layers at rates >1.4 microm/min without any yield destroying
whiskers or extrusions.
With frontside processing complete, wafers are thinned down to 50 microm or less to
reduce 'on-state' resistance and solder metal layers are deposited on the backside. No
supporting carrier substrates are used and the ultra-thin, large area wafer will deform
under the influence of uncontrolled film stresses, with miss-handling a potential
consequence. The Sigma fxP carries thin wafer handling hardware and uses film deposition
stress control techniques to deliver high throughput processes with low wafer bow.
Currently, seven out of the top ten power device manufacturers, and all major
foundries use the Sigma fxP as the process tool of record for power PVD processing. With
power device manufacturing moving to 300mm format wafers, SPTS has successfully
transferred its market leading process knowledge and capability to the new platform.
"We are pleased to offer customers a complete solution for 300 mm Power PVD
processing," said Chris Jones, product marketing manager at SPTS. "Sigma fxP systems are
in full production for frontside thick Al and thin wafer backside processing. We are
prepared to support the IDMs and foundries as they make the transition from 150 and 200mm
wafer formats to 300mm."
About SPTS Technologies
SPTS Technologies (a Bridgepoint portfolio company) designs, manufactures, sells, and
supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced
packaging, LEDs, high speed RF on GaAs, and power management device markets. With
manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose,
California, the company operates across 19 countries in Europe, North America and
Asia-Pacific. For more information about SPTS Technologies, please visit
http://www.spts.com
Photo:
http://photos.prnewswire.com/prnh/20130116/588621
Photo:http://photos.prnewswire.com/prnh/20130116/588621
http://photoarchive.ap.org/
SPTS Technologies Ltd
CONTACT: Company Contact: Evelyn Tay, Tel: +44(0)7885-70-6565, Evelyn.Tay@spts.com