Press Releases

Author
Aron Schatz
Posted
June 2, 2005
Views
1427
Tags News

Page All:

Page 1
Here are some Press Releases to grace my inbox

VIA C7-M Mobile Processor Unveiled at Computex and VTF2005

Quote

Taipei, Taiwan, 1 June 2005 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today launched the VIA C7-M mobile processor at the VIA Technology Forum 2005, with compact notebooks exemplifying the 'Simply Mobile' lifestyle featured on the VIA booth at Computex 2005.

Specifically designed for the rapid-growth mobile segments of mainstream and thin and light notebooks and ultra portable devices, the VIA C7-M boasts a winning formula of superb power consumption and management for longer battery life, all the performance required for all the popular digital media and productivity applications with speeds of up to 2.0GHz, and an unrivalled suite of security features integrated directly onto the processor die for easy and practical deployment of high-end security functionality.

"With its perfect blend of performance, power management, profile and price, the VIA C7-M processor can do more to drive notebooks mainstream than any other single innovation on the mobile platform," said Richard Brown, Associate Vice President of Marketing, VIA Technologies, Inc. "Moreover, as security rapidly becomes the number one concern in the mobile space, the extensive hardware security within the VIA C7-M brings pervasive information security in the mobile space within easy and practical reach for the first time."

The VIA C7 processor combines exceptionally low power consumption with a host of unique technologies to maintain cool running and extend battery life. The enhanced VIA PowerSaver technology combines superior power management through defining intelligent power stage changes with ultra low power levels in sleep mode, while the advanced 90nm system-on-insulator (SOI) process allows unprecedented levels of integration within the tiny 30mm2 processor die, permitting performance scalability and considerable feature additions while maintaining the signature low power draw of VIA processors.


Shuttle releases new XPC Accessories at Computex 2005

Quote

(Taipei, Taiwan — May 31, 2005) Shuttle Inc - the world’s leading designer and manufacturer of small form factor (SFF) PCs and accessories - has today released two new enhancements for its XPC products at Computex Taipei 2005.

“At Shuttle we are dedicated to creating the most advanced small form factor products on the market,” began Ken Huang, Chief Architect of the XPC, “With the innovative designs of our motherboard, chassis, and cooling systems and our powerful integrated software tools, we can proudly offer performance and functionality comparable to full-sized desktop PC systems. XPC Accessories are a continuation of this package, guaranteeing that end-users will have opportunity to extend and enhance their XPC based systems as technology advances or if their computing needs change.”

New products released today are the PN18 Wireless LAN Module and the PE20 Xtended Storage Enclosure.

The PN18 Wireless LAN Module is a 802.11b/g compliant wireless kit with in-built support for WEP and WPA encryption standards. Designed particularly for Shuttle’s P and i chassis XPCs, the PN18 continues the innovative toolless design of these models with a simple slot-in installation the can be completed in seconds. Bundled with the kit is Shuttle Access Point Software, a powerful utility which makes the process of building a home or small office network quick and easy.


Corsair Leads Industry in DDR2 Transition with Launch of XMS2-8000UL

Quote

Fremont, CA (May 27, 2005) - Corsair® Memory, Inc., a worldwide leader in high performance memory and cooling products for enthusiasts and overclockers, today is pleased to unveil XMS2-8000ULTM as its latest addition to the high performance XMS family of products. First in the industry to ship DDR2 memory modules at factory default frequency of 1GHz, Corsair once again demonstrates its leadership position in high performance products and commitment to support platform transitions.

Available immediately in both single module and dual kit packages and rated to run at aggressive latency settings of 5-4-4-9, the new XMS2-8000UL was developed in collaboration with ASUS® Computer for its latest Intel® i955X chipset based motherboard, the P5WD2 Premium. Backed with a life time warranty and a potential to be overclocked to 1066+ Mhz, Corsair's new XMS2-8000UL complements ASUS' P5WD2 Premium motherboard as the ultimate choice for enthusiasts. In SiSoft Sandra memory test performed at Corsair, overclocking XMS2-8000UL memory to 1066 MHz delivers an incredible 17% memory performance improvement compared with DDR2-667. Leveraging Intel processor's native support for multi-threaded tasks, Corsair brings new memory capability to the platform to run memory intensive applications such as 3D games concurrently with other demanding applications.

"Last month, we saw enthusiasts worldwide overclocking our ultra low latency XMS2-5400ULTM memory modules to over 1GHz. This month, we are pushing the envelope further with the introduction of the native low-latency 1GHz parts" said John Beekley, VP of Applications Engineering at Corsair. "Corsair's engineers have achieved a milestone in memory development with the XMS2-8000UL. Combined with the availability of performance motherboards such as the ASUS P5WD2, we expect adoption of high performance DDR2 memory to explode," continued Beekley.

Title

Medium Image View Large