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=?ISO-8859-1?Q?Quantance_CEO_to_Present_Game-Cha?= =?ISO-8859-1?Q?nging_Envelope_Tracking_Power_Sup?= =?ISO-8859-1?Q?ply_Technology_at_MIPI=AE_Alliance_?= =?ISO-8859-1?Q?Booth_during_Mobile_World_Cong

Poster: SySAdmin
Posted on February 22, 2012 at 8:14:01 AM
Quantance CEO to Present Game-Changing Envelope Tracking Power Supply Technology at MIPIĀ® Alliance Booth during Mobile World Congress

February 29 Presentation to Focus on Innovative New Product That Dramatically Enhances 4G/LTE Performance for Baseband/Transceiver Chipset Providers and Device Manufacturers

SAN MATEO, Calif., Feb. 22, 2012 /PRNewswire/ -- Quantance Inc., manufacturer of ultra-fast, 4G/LTE envelope tracking (ET) power supplies, today announced that its CEO and Co-Founder Vikas Vinayak will be a presenter at the MIPI Alliance forum during the Mobile World Congress on Wednesday, February 29, 2012, from 13:00-14:00 CET. The MIPI Alliance booth is located at App Planet (Hall7) - 7H10.

Vinayak will discuss Quantance's latest product, the Q845 ET power supply, which was announced last month. Featuring Quantance's qBoost(TM) technology, the Q845 provides the power amplifier (PA) efficiency benefits required for all the latest mobile device designs. It also offers an innovative, highly efficient, instantaneous boosting capability that significantly increases 3G and 4G/LTE PA peak transmit power, which dramatically improves the high-speed data performance in tablets, smartphones, mobile hot spots, data cards and other high-speed mobile devices.

The Q845 - a small, single-chip product - is the third-generation implementation of the company's qBoost(TM) technology, which provides the response time equivalent of a 400MHz switcher for ET systems and is over 100 times faster than any other mobile ET power supply solution available today. This ultra-fast performance, along with a more streamlined architecture and a tiny chip footprint, sets a new industry standard for size, cost and integration simplicity.

Quantance is an active participant and contributing member within the MIPI Alliance to help drive the formal standardization of ET specifications for the interface to the power supply, including both the ET analog interface (the "ET Subgroup," which MIPI announced November, 2011) and digital control interface ("RFFE V1.10," which MIPI announced January, 2012).  The Q845 plans compatibility with upcoming standards-based ET control and envelope interfaces, which will enable the Q845 to be openly and seamlessly integrated into any 4G/LTE baseband and transceiver chipset platform targeted for use in mobile high-speed data devices.

The need for effective ET solutions in chipset reference designs has grown dramatically in the past year, in direct relation to the explosive growth in high-speed data and the mass-market deployment of LTE devices.  ET solutions provide the 4G/LTE PA efficiency and transmit power improvements critical to ensure LTE performance, and many chipset providers are already planning to integrate ET solutions in their latest platforms.

About Quantance
Quantance, a venture-backed semiconductor startup based in Silicon Valley, was founded to build the industry's fastest power supplies. Investors include TD Fund, Granite Ventures, InterWest Partners and DoCoMo Capital. For more information, please visit http://www.quantance.com.

MIPIĀ® is a registered mark of MIPI Alliance, Inc.

SOURCE  Quantance Inc.

Quantance Inc.

CONTACT: Theresa Maloney of Cogenta Communications, +1-415-225-5261, theresa@cogentacom.com for Quantance Inc.

Web Site: http://www.mobileworldcongress.com
 
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