TI introduces affordable, sub-1 GHz wireless connectivity for ultra-low-power MSP430 LaunchPad development kit
Poster: SySAdmin
Posted on November 30, 2011 at 9:07:01 AM
TI introduces affordable, sub-1 GHz wireless connectivity for ultra-low-power MSP430 LaunchPad development kit
RF BoosterPack includes ETSI-compliant and FCC-certified module, helps reduce costs and development time for toys, remote controls, home automation, security systems and more
DALLAS, Nov. 30, 2011 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN), the industry leader in highly integrated wireless connectivity solutions, today announced a sub-1 GHz radio frequency (RF) value line plug-in-board for TI's MSP430(TM) microcontroller LaunchPad development kit. The new 430BOOST-CC110L RF BoosterPack includes ETSI-compliant and FCC-certified modules to help speed development time, reduce certification costs and eliminate barriers associated with the RF hardware design process. The RF BoosterPack and MSP430 LaunchPad offer developers affordable solutions for cost-sensitive sub-1 GHz RF applications such as remote controls, toys, home and building automation, and security systems. The 430BOOST-CC110L is available today for $19, and the MSP430 LaunchPad is separately available for $4.30. For more information, see http://www.ti.com/rfboosterpack-pr.
"We are excited to bring wireless connectivity to the more than 100,000 MSP430 LaunchPads in the market today, and provide a simple, cost-effective development platform for those looking to innovate wireless products with MSP430 microcontrollers," said Erling Simensen, product marketing manager, Low-Power RF, TI. "By combining TI's leading ultra-low-power MSP430 microcontrollers with our sub-1 GHz RF value line transceivers, we are delivering easy-to-use, affordable and scalable solutions to wirelessly connect more cost-sensitive consumer applications."
Additionally, the RF module included on the RF BoosterPack is separately available as an ETSI-compliant and FCC-certified production-ready module. The A110LR09A RF module is available from TI third party developer Anaren, Inc., and can be tested using the 430BOOST-CC110L development tool.
Key features and benefits: TI's sub-1 GHz RF BoosterPack
-- Easily add sub-1 GHz wireless connectivity to MSP430 LaunchPad
(MSP-EXP430G2)
-- RF BoosterPack contains two plug-in-boards with RF modules
integrating TI's CC110L sub-1 GHz RF value line transceiver, passive
components and compact PCB antenna
-- CD with software and documentation
-- Easy to use wireless software stack (AIR BoosterStack from Anaren)
makes it easy for developers to add RF to any system
-- Reduce development costs
-- Sub-$30 total cost for complete RF BoosterPack development
environment: One 430BOOST-CC110L RF BoosterPack ($19) and two MSP430
LaunchPads ($4.30 each)
-- ETSI-compliant and FCC-certified solution eliminates costly
intentional radiator certification process
-- No RF hardware design required, designer can add module as an
embedded PCB component
-- Free software development tools for writing, debugging and compiling
code on MSP430 value line devices
-- Leverage the products' scalability
-- Operation in the 868 and 915 MHz bands
-- Programs developed on MSP430 LaunchPad can be migrated to higher-end
MSP430 devices
-- Production-ready CC110L-based A110LR09A module available separately
from TI third party developer Anaren, Inc.
Tools, availability and pricing
The 430BOOST-CC110L sub-1 GHz RF value line BoosterPack is available today from TI and through authorized distributors for $19. The module included on the BoosterPack is available as a stand-alone product from Anaren through their authorized distributors. The MSP430 microcontroller value line LaunchPad development kit is available today for $4.30 from TI and authorized distributors.
Find out more about TI's low-power RF solutions and MSP430 microcontrollers
-- TI's RF BoosterPack (430BOOST-CC110L): http://www.ti.com/rfboosterpack
-- TI's sub-1 GHz RF value line: http://www.ti.com/rfvalueline
-- TI's sub-1 GHz RF performance line: http://www.ti.com/rfperformanceline
-- TI's MSP430 LaunchPad: http://www.ti.com/launchpad
-- TI's wireless connectivity solutions: http://www.ti.com/wirelessconnectivity
-- TI E2E(TM) low-power RF & wireless connectivity community:
http://www.ti.com/lprf-forum
About TI's wireless connectivity portfolio
TI provides the industry's broadest portfolio of mature wireless connectivity solutions. With expertise in more than a dozen technologies, TI ensures customers the best-suited wireless connectivity for every type of application. TI's product portfolio is complemented with the support and tools that customers and developers need to quickly and easily bring wirelessly connected designs to market. Visit the company's Wireless Connectivity Portal for an overview of TI-supported technologies, the full product portfolio, and example use cases.
About Texas Instruments
Texas Instruments semiconductor innovations help 80,000 customers unlock the possibilities of the world as it could be - smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do - from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.
Trademarks
MSP430 and TI E2E is a trademark of Texas Instruments. All other trademarks belong to their respective owners.
SOURCE Texas Instruments Incorporated
Photo:http://photos.prnewswire.com/prnh/20010105/NEF016LOGO
http://photoarchive.ap.org/
Texas Instruments Incorporated
CONTACT: Liv Lokka of Texas Instruments, +47 22958207, l.lokka@ti.com; or Melissa Haddad of GolinHarris, +1-972-341-2543, mhaddad@golinharris.com
Web Site: http://www.ti.com
RF BoosterPack includes ETSI-compliant and FCC-certified module, helps reduce costs and development time for toys, remote controls, home automation, security systems and more
DALLAS, Nov. 30, 2011 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN), the industry leader in highly integrated wireless connectivity solutions, today announced a sub-1 GHz radio frequency (RF) value line plug-in-board for TI's MSP430(TM) microcontroller LaunchPad development kit. The new 430BOOST-CC110L RF BoosterPack includes ETSI-compliant and FCC-certified modules to help speed development time, reduce certification costs and eliminate barriers associated with the RF hardware design process. The RF BoosterPack and MSP430 LaunchPad offer developers affordable solutions for cost-sensitive sub-1 GHz RF applications such as remote controls, toys, home and building automation, and security systems. The 430BOOST-CC110L is available today for $19, and the MSP430 LaunchPad is separately available for $4.30. For more information, see http://www.ti.com/rfboosterpack-pr.
"We are excited to bring wireless connectivity to the more than 100,000 MSP430 LaunchPads in the market today, and provide a simple, cost-effective development platform for those looking to innovate wireless products with MSP430 microcontrollers," said Erling Simensen, product marketing manager, Low-Power RF, TI. "By combining TI's leading ultra-low-power MSP430 microcontrollers with our sub-1 GHz RF value line transceivers, we are delivering easy-to-use, affordable and scalable solutions to wirelessly connect more cost-sensitive consumer applications."
Additionally, the RF module included on the RF BoosterPack is separately available as an ETSI-compliant and FCC-certified production-ready module. The A110LR09A RF module is available from TI third party developer Anaren, Inc., and can be tested using the 430BOOST-CC110L development tool.
Key features and benefits: TI's sub-1 GHz RF BoosterPack
-- Easily add sub-1 GHz wireless connectivity to MSP430 LaunchPad
(MSP-EXP430G2)
-- RF BoosterPack contains two plug-in-boards with RF modules
integrating TI's CC110L sub-1 GHz RF value line transceiver, passive
components and compact PCB antenna
-- CD with software and documentation
-- Easy to use wireless software stack (AIR BoosterStack from Anaren)
makes it easy for developers to add RF to any system
-- Reduce development costs
-- Sub-$30 total cost for complete RF BoosterPack development
environment: One 430BOOST-CC110L RF BoosterPack ($19) and two MSP430
LaunchPads ($4.30 each)
-- ETSI-compliant and FCC-certified solution eliminates costly
intentional radiator certification process
-- No RF hardware design required, designer can add module as an
embedded PCB component
-- Free software development tools for writing, debugging and compiling
code on MSP430 value line devices
-- Leverage the products' scalability
-- Operation in the 868 and 915 MHz bands
-- Programs developed on MSP430 LaunchPad can be migrated to higher-end
MSP430 devices
-- Production-ready CC110L-based A110LR09A module available separately
from TI third party developer Anaren, Inc.
Tools, availability and pricing
The 430BOOST-CC110L sub-1 GHz RF value line BoosterPack is available today from TI and through authorized distributors for $19. The module included on the BoosterPack is available as a stand-alone product from Anaren through their authorized distributors. The MSP430 microcontroller value line LaunchPad development kit is available today for $4.30 from TI and authorized distributors.
Find out more about TI's low-power RF solutions and MSP430 microcontrollers
-- TI's RF BoosterPack (430BOOST-CC110L): http://www.ti.com/rfboosterpack
-- TI's sub-1 GHz RF value line: http://www.ti.com/rfvalueline
-- TI's sub-1 GHz RF performance line: http://www.ti.com/rfperformanceline
-- TI's MSP430 LaunchPad: http://www.ti.com/launchpad
-- TI's wireless connectivity solutions: http://www.ti.com/wirelessconnectivity
-- TI E2E(TM) low-power RF & wireless connectivity community:
http://www.ti.com/lprf-forum
About TI's wireless connectivity portfolio
TI provides the industry's broadest portfolio of mature wireless connectivity solutions. With expertise in more than a dozen technologies, TI ensures customers the best-suited wireless connectivity for every type of application. TI's product portfolio is complemented with the support and tools that customers and developers need to quickly and easily bring wirelessly connected designs to market. Visit the company's Wireless Connectivity Portal for an overview of TI-supported technologies, the full product portfolio, and example use cases.
About Texas Instruments
Texas Instruments semiconductor innovations help 80,000 customers unlock the possibilities of the world as it could be - smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do - from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.
Trademarks
MSP430 and TI E2E is a trademark of Texas Instruments. All other trademarks belong to their respective owners.
SOURCE Texas Instruments Incorporated
Photo:http://photos.prnewswire.com/prnh/20010105/NEF016LOGO
http://photoarchive.ap.org/
Texas Instruments Incorporated
CONTACT: Liv Lokka of Texas Instruments, +47 22958207, l.lokka@ti.com; or Melissa Haddad of GolinHarris, +1-972-341-2543, mhaddad@golinharris.com
Web Site: http://www.ti.com