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ChipSiP Unveils Cutting-edge SiP Solutions to Experience an Unlimited Sharing Life
TAIPEI, Taiwan, October 6, 2011/PRNewswire/ --
ChipSiP Technology Co, Ltd. (Taiwan: 3637), a leading company in turnkey
SiP solutions, launched three new products featuring optimum slimness,
portability and connectivity for a connected life of cloud computing through
the integrated design of Logic, RF and Turnkey solutions. SiP is bringing a
smart, connected life to consumers who will be able to share special moments
of their lives with ease through various connected devices such as
smartphones, digital cameras, camcorders, tablet PCs and TVs.
ChipSiP Chairperson Feng Lai said: "With mounting anticipation for
multimedia devices such as tablet PCs and smartphones, we are launching the
most high-density 7-in-1 SiP, a slimmest tablet PC with 9.85mm and the most
light-weighted WiDi in the world weighing only 90 grams. In addition to the
breakthrough in multi-chip design technology and device dimension, we have
proven yet again that SiP technology embedded in daily life can be fun, easy
and exciting, and the use of these multimedia applications will enable
consumers to embrace a new lifestyle, thanks to those simple-to-use smart
devices."
Advanced SiP technology shrinks PCB size by a whopping 80% from
mainstream tablet PCs
ChipSiP leverages its core value of system integration and
miniaturization design to successfully combine application processor, 2
units of DDR3, 2 units of NAND, WiFi, Bluetooth in a 7-in-1 SiP that is only
18 x 18mm in size. This design will usher in a brand-new chapter for lighter
and slimmer tablet PCs and smartphone.
ChipSiP also announced its enhanced WiDi design, a WiDi dongle that
weighs only 90 grams and features the WiFi MIMO technology to allow
multimedia contents such as video, photos and web pages to be transmitted
wirelessly from PCs, tablet PCs, and smartphones to television.
ChipSiP develops a new tablet PC turnkey solution featuring a thickness
as thin as 9.85mm and only 47mm2 in dimension to enable a lighter weight,
better performance and better power-efficiency. With miniaturized memory SiP
and RF SiP in combination with Android, consumers will enjoy more fun and
convenience as a result of real-time sharing anytime, anywhere. In addition,
ChipSiP will release a high-end tablet PC solution with CPU clock speed of
1GHz as well as the world's thinnest design at 8.6mm in Q4.
Media Contact:
Fenny Chen
Phone: +886-2-8227-1799 ext. 2101
Email: fennychen@chipsip.com
Source: ChipSiP Technology Co, Ltd.
.
ChipSiP Unveils Cutting-edge SiP Solutions to Experience an Unlimited Sharing Life
TAIPEI, Taiwan, October 6, 2011/PRNewswire/ --
ChipSiP Technology Co, Ltd. (Taiwan: 3637), a leading company in turnkey
SiP solutions, launched three new products featuring optimum slimness,
portability and connectivity for a connected life of cloud computing through
the integrated design of Logic, RF and Turnkey solutions. SiP is bringing a
smart, connected life to consumers who will be able to share special moments
of their lives with ease through various connected devices such as
smartphones, digital cameras, camcorders, tablet PCs and TVs.
ChipSiP Chairperson Feng Lai said: "With mounting anticipation for
multimedia devices such as tablet PCs and smartphones, we are launching the
most high-density 7-in-1 SiP, a slimmest tablet PC with 9.85mm and the most
light-weighted WiDi in the world weighing only 90 grams. In addition to the
breakthrough in multi-chip design technology and device dimension, we have
proven yet again that SiP technology embedded in daily life can be fun, easy
and exciting, and the use of these multimedia applications will enable
consumers to embrace a new lifestyle, thanks to those simple-to-use smart
devices."
Advanced SiP technology shrinks PCB size by a whopping 80% from
mainstream tablet PCs
ChipSiP leverages its core value of system integration and
miniaturization design to successfully combine application processor, 2
units of DDR3, 2 units of NAND, WiFi, Bluetooth in a 7-in-1 SiP that is only
18 x 18mm in size. This design will usher in a brand-new chapter for lighter
and slimmer tablet PCs and smartphone.
ChipSiP also announced its enhanced WiDi design, a WiDi dongle that
weighs only 90 grams and features the WiFi MIMO technology to allow
multimedia contents such as video, photos and web pages to be transmitted
wirelessly from PCs, tablet PCs, and smartphones to television.
ChipSiP develops a new tablet PC turnkey solution featuring a thickness
as thin as 9.85mm and only 47mm2 in dimension to enable a lighter weight,
better performance and better power-efficiency. With miniaturized memory SiP
and RF SiP in combination with Android, consumers will enjoy more fun and
convenience as a result of real-time sharing anytime, anywhere. In addition,
ChipSiP will release a high-end tablet PC solution with CPU clock speed of
1GHz as well as the world's thinnest design at 8.6mm in Q4.
Media Contact:
Fenny Chen
Phone: +886-2-8227-1799 ext. 2101
Email: fennychen@chipsip.com
Source: ChipSiP Technology Co, Ltd.
.