CEVA and Carbon Design Systems Partner to Offer Fast Simulation Models for CEVA DSPs
Poster: SySAdmin
Posted on June 7, 2011 at 6:14:01 AM
CEVA and Carbon Design Systems Partner to Offer Fast Simulation Models for CEVA DSPs
Carbon's virtual models available for CEVA-X and CEVA-XC DSPs, enabling cycle-accurate, pre-silicon hardware and software development
SAN DIEGO, June 7, 2011 /PRNewswire/ -- Design Automation Conference --CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Carbon Design Systems(TM), the leading supplier of solutions for architectural analysis, performance optimization and pre-silicon firmware debug, today announced the availability of fast simulation models for CEVA's industry-leading CEVA-X and CEVA-XC DSP families, dramatically reducing customers' hardware and software development time for next-generation System-on-Chip designs. The first models are already available, delivering 100% cycle accuracy for each processor and can be accessed through Carbon's IP Exchange web portal.
(Logo: http://photos.prnewswire.com/prnh/20051010/CEVALOGO)
As part of the collaboration, CEVA's comprehensive software development tools suite, CEVA-ToolBox(TM) was enhanced to integrate with Carbon's SoCDesigner Plus virtual platform, providing users a direct DSP software debug capability throughout the virtual prototyping process. The integration of these models based on implementations of the CEVA-X and CEVA-XC DSP families are already in use by leading semiconductor customers for advanced wireless application development.
"We are pleased to partner with CEVA to offer cycle accurate, virtual models of their industry-leading DSPs, and enable the development of pre-silicon hardware and software for a range of end markets," said Bill Neifert, chief technical officer at Carbon Design Systems. "These fast models can significantly shorten customers design cycles, system verification and software development, lowering overall development costs and simplifying SoC design."
"Cycle accurate simulation models and SoC virtual prototyping play an increasingly important role in system design by simulating hardware / software system behavior and shortening design cycles for SoCs," said Eran Briman, vice president of marketing at CEVA. "Virtual models of our CEVA DSPs integrated with Carbon SoC Designer Plus enable complete system validation of hardware and software before silicon is available, delivering value through the entire design cycle."
Availability
Carbon's 100% cycle accurate models and CEVA's Fast Models of members of the CEVA-X and CEVA-XC families of DSPs are available today at Carbon's IP Exchange web portal: http://www.carbonipexchange.com.
About Carbon Design Systems
Carbon offers the industry's only unified virtual platform solution along with the leading solution for accurate IP model creation. Carbon virtual platforms can execute at 100s of MIPS and with 100% accuracy to enable application software development, detailed architectural analysis and secure IP model distribution. Carbon's solutions are based on open industry standards, including SystemC, IP-XACT, Verilog, VHDL, OSCI TLM, MDI, CASI, CADI and CAPI. Carbon's customers are systems, semiconductor, and IP companies that focus on wireless, networking, and consumer electronics. Carbon is headquartered at 125 Nagog Park, Acton, Mass., 01720. Telephone: (978) 264-7300. Facsimile: (978) 264-9990. Email: info@carbondesignsystems.com. Website: http://www.carbondesignsystems.com.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit http://www.ceva-dsp.com. Follow CEVA on twitter at http://www.twitter.com/cevadsp.
SOURCE CEVA, Inc.
Photo:http://photos.prnewswire.com/prnh/20051010/CEVALOGO
http://photoarchive.ap.org/
CEVA, Inc.
CONTACT: Richard Kingston, CEVA, Inc., +1-650-417-7976, richard.kingston@ceva-dsp.com; or Mike Sottak, Wired Island, Ltd., +1-408-876-4418, mike@wiredislandpr.com
Web Site: http://www.carbondesignsystems.com
Carbon's virtual models available for CEVA-X and CEVA-XC DSPs, enabling cycle-accurate, pre-silicon hardware and software development
SAN DIEGO, June 7, 2011 /PRNewswire/ -- Design Automation Conference --CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Carbon Design Systems(TM), the leading supplier of solutions for architectural analysis, performance optimization and pre-silicon firmware debug, today announced the availability of fast simulation models for CEVA's industry-leading CEVA-X and CEVA-XC DSP families, dramatically reducing customers' hardware and software development time for next-generation System-on-Chip designs. The first models are already available, delivering 100% cycle accuracy for each processor and can be accessed through Carbon's IP Exchange web portal.
(Logo: http://photos.prnewswire.com/prnh/20051010/CEVALOGO)
As part of the collaboration, CEVA's comprehensive software development tools suite, CEVA-ToolBox(TM) was enhanced to integrate with Carbon's SoCDesigner Plus virtual platform, providing users a direct DSP software debug capability throughout the virtual prototyping process. The integration of these models based on implementations of the CEVA-X and CEVA-XC DSP families are already in use by leading semiconductor customers for advanced wireless application development.
"We are pleased to partner with CEVA to offer cycle accurate, virtual models of their industry-leading DSPs, and enable the development of pre-silicon hardware and software for a range of end markets," said Bill Neifert, chief technical officer at Carbon Design Systems. "These fast models can significantly shorten customers design cycles, system verification and software development, lowering overall development costs and simplifying SoC design."
"Cycle accurate simulation models and SoC virtual prototyping play an increasingly important role in system design by simulating hardware / software system behavior and shortening design cycles for SoCs," said Eran Briman, vice president of marketing at CEVA. "Virtual models of our CEVA DSPs integrated with Carbon SoC Designer Plus enable complete system validation of hardware and software before silicon is available, delivering value through the entire design cycle."
Availability
Carbon's 100% cycle accurate models and CEVA's Fast Models of members of the CEVA-X and CEVA-XC families of DSPs are available today at Carbon's IP Exchange web portal: http://www.carbonipexchange.com.
About Carbon Design Systems
Carbon offers the industry's only unified virtual platform solution along with the leading solution for accurate IP model creation. Carbon virtual platforms can execute at 100s of MIPS and with 100% accuracy to enable application software development, detailed architectural analysis and secure IP model distribution. Carbon's solutions are based on open industry standards, including SystemC, IP-XACT, Verilog, VHDL, OSCI TLM, MDI, CASI, CADI and CAPI. Carbon's customers are systems, semiconductor, and IP companies that focus on wireless, networking, and consumer electronics. Carbon is headquartered at 125 Nagog Park, Acton, Mass., 01720. Telephone: (978) 264-7300. Facsimile: (978) 264-9990. Email: info@carbondesignsystems.com. Website: http://www.carbondesignsystems.com.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit http://www.ceva-dsp.com. Follow CEVA on twitter at http://www.twitter.com/cevadsp.
SOURCE CEVA, Inc.
Photo:http://photos.prnewswire.com/prnh/20051010/CEVALOGO
http://photoarchive.ap.org/
CEVA, Inc.
CONTACT: Richard Kingston, CEVA, Inc., +1-650-417-7976, richard.kingston@ceva-dsp.com; or Mike Sottak, Wired Island, Ltd., +1-408-876-4418, mike@wiredislandpr.com
Web Site: http://www.carbondesignsystems.com