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AEM's Tin Whisker Mitigation Process Assures Surface-Mount Component Reliability
Sn/Pb re-plating process inhibits tin whisker growth in components for mission critical and life sustaining applications; also avoids thermal shock damage to surface-mount components due to hot-solder dipping.
SAN DIEGO, Jan. 19, 2011 /PRNewswire/ -- AEM, Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dipping while ensuring that converted component terminations contain a minimum of 5% Pb as verified by SEM/EDS and XRF inspection methods. AEM's Sn/Pb conversion process is best suited for chip-scale passive components, including capacitors, inductors, resistors, ferrite chip beads, fuses, resistor arrays, capacitor arrays, bead arrays and many molded body passive and active surface-mount component types. This process includes 100 percent adherence to visual and mechanical inspections per applicable EIA guidelines, including sample solderability, leach resistance, terminal strength, and destructive physical analysis (DPA) screening.
"Components terminated entirely with a tin solder are susceptible to unpredictable whisker growth," said AEM's Marketing Director, Scott Sentz. "And for ultra-high-reliability applications, RoHS-compliant devices must be converted back to tin/lead terminations. Components with external leads can be hot-solder-dipped, but this is not the case for chip-style components due to thermal shock concerns."
While AEM's Sn/Pb conversion process is applicable to most multi-layer, chip-style components, other component types may be processed subject to an AEM pre-evaluation and component construction analysis, which is typically performed by AEM at no cost to the customer. Optional component up-screening (e.g., up-rating commercial components for use in military, aerospace or medical applications) and QCI can be performed by AEM's MIL-STD-202 compliant and AS9100 certified lab. Converted and up-screened components are warranted as AEM products.
About AEM, Inc.
AEM, Inc., founded in 1986 is an award-winning high-tech company with its leading technologies in proprietary materials, patented processes, and specialty equipment for the manufacturing of high reliability electronic components. Phenomenal growth since its inception had earned AEM the distinction of being listed three times on the Inc. 500 list of "America's Fastest-Growing Private Companies". AEM high-reliability fuses are used by NASA and every other major manufacturer of satellite, spacecraft and space related hardware throughout the world. AEM is also the world's sole manufacturer of high-reliability ferrite chip beads designed for the space and military use.
Editorial Contact:
Scott Sentz, Marketing Director
AEM, Inc.
858.481.0210 x 1658
ssentz@aem-usa.com
Media Contact:
Greg Evans, Account Executive
WelComm, Inc.
858.279.2100
greg@welcomm.com
SOURCE AEM, Inc.
AEM, Inc.
CONTACT: Editorial, Scott Sentz, Marketing Director of AEM, Inc., +1-858-481-0210, ext. 1658, ssentz@aem-usa.com; or Media, Greg Evans, Account Executive of WelComm, Inc., +1-858-279-2100, greg@welcomm.com, for AEM, Inc.
Web Site: http://www.aem-usa.com
AEM's Tin Whisker Mitigation Process Assures Surface-Mount Component Reliability
Sn/Pb re-plating process inhibits tin whisker growth in components for mission critical and life sustaining applications; also avoids thermal shock damage to surface-mount components due to hot-solder dipping.
SAN DIEGO, Jan. 19, 2011 /PRNewswire/ -- AEM, Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dipping while ensuring that converted component terminations contain a minimum of 5% Pb as verified by SEM/EDS and XRF inspection methods. AEM's Sn/Pb conversion process is best suited for chip-scale passive components, including capacitors, inductors, resistors, ferrite chip beads, fuses, resistor arrays, capacitor arrays, bead arrays and many molded body passive and active surface-mount component types. This process includes 100 percent adherence to visual and mechanical inspections per applicable EIA guidelines, including sample solderability, leach resistance, terminal strength, and destructive physical analysis (DPA) screening.
"Components terminated entirely with a tin solder are susceptible to unpredictable whisker growth," said AEM's Marketing Director, Scott Sentz. "And for ultra-high-reliability applications, RoHS-compliant devices must be converted back to tin/lead terminations. Components with external leads can be hot-solder-dipped, but this is not the case for chip-style components due to thermal shock concerns."
While AEM's Sn/Pb conversion process is applicable to most multi-layer, chip-style components, other component types may be processed subject to an AEM pre-evaluation and component construction analysis, which is typically performed by AEM at no cost to the customer. Optional component up-screening (e.g., up-rating commercial components for use in military, aerospace or medical applications) and QCI can be performed by AEM's MIL-STD-202 compliant and AS9100 certified lab. Converted and up-screened components are warranted as AEM products.
About AEM, Inc.
AEM, Inc., founded in 1986 is an award-winning high-tech company with its leading technologies in proprietary materials, patented processes, and specialty equipment for the manufacturing of high reliability electronic components. Phenomenal growth since its inception had earned AEM the distinction of being listed three times on the Inc. 500 list of "America's Fastest-Growing Private Companies". AEM high-reliability fuses are used by NASA and every other major manufacturer of satellite, spacecraft and space related hardware throughout the world. AEM is also the world's sole manufacturer of high-reliability ferrite chip beads designed for the space and military use.
Editorial Contact:
Scott Sentz, Marketing Director
AEM, Inc.
858.481.0210 x 1658
ssentz@aem-usa.com
Media Contact:
Greg Evans, Account Executive
WelComm, Inc.
858.279.2100
greg@welcomm.com
SOURCE AEM, Inc.
AEM, Inc.
CONTACT: Editorial, Scott Sentz, Marketing Director of AEM, Inc., +1-858-481-0210, ext. 1658, ssentz@aem-usa.com; or Media, Greg Evans, Account Executive of WelComm, Inc., +1-858-279-2100, greg@welcomm.com, for AEM, Inc.
Web Site: http://www.aem-usa.com